By Khaled Salah, Yehea Ismail, Visit Amazon's Alaa El-Rouby Page, search results, Learn about Author Central, Alaa El-Rouby,
This e-book offers a wide-band and know-how autonomous, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version money owed for quite a few results, together with pores and skin impact, depletion capacitance and within sight touch results. Readers will make the most of in-depth assurance of strategies and know-how comparable to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. suggestions lined are established by utilizing TSVs in functions resembling a spiral inductor and inductive-based communique approach and bandpass filtering.
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Extra resources for Arbitrary Modeling of TSVs for 3D Integrated Circuits
G. Friedman, Closed-form expressions of 3-D via resistance, inductance, and capacitance. IEEE Transac. Electr. Dev. 56(9), 1873–1881 (2009) 46 2 3D/TSV-Enabling Technologies 21. R. Weerasekera, D. Pamunuwa, M. Grange, H. -R. Zheng, Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs), in Proceedings of Workshop 3-D Integration, DATE Conference, April 2009 22. E. Eid, T. Lacrevaz, S. de Rivaz, C. Bermond, B. Flchet, F. Calmon, C. Gontrand, A. Farcy, L. Cadix, P.
Therefore, new cooling techniques must be innovated to ensure that the chip can operate at appropriate temperatures and perform as required reliably [30, 31]. The recent techniques in thermal modeling and management are summarized in Figs. 18. 3 CAD Tools Challenges The addition of a third dimension would require support from more advanced CAD tools. 3D-IC physical design has attracted an increasing amount of attention. There is a significant amount of work on the floorplanning, placement, and routing for 3DICs.
Fayollea, B. Charleta, T. Enota, M. Zussya, B. C. Barbea, N. Kerneveza, S. Maitrejeana, D. Louisa, G. Passemardc, Challenges for 3D IC integration: bonding quality and thermal managementc, IEEE, 2007 31. Y. J. O. C. 681–684 32. C. Chiang, S. 429–436 33. A. Rahman, R. Reif, System-level performance evaluation of three-dimensional integrated circuits. IEEE Trans. VLSI Syst. (Special Issue on System-Level Interconnect Prediction) 8(6), 671–678 (2000) 34. com/ 35. com/ 36. html 37. B. -L. Hung, F.
Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah, Yehea Ismail, Visit Amazon's Alaa El-Rouby Page, search results, Learn about Author Central, Alaa El-Rouby,